P-ZT201 Water-Based Spray-In-Air Cleaning Agent PCBA Defluxing Cleaner for Flux Removal
P-ZT201
minimum order
1 piece
Supply Ability
10000piece / Month
Country of Origin
China
Stock Time
3Day
Quantity:
P-ZT201 Water-Based Spray-In-Air Cleaning Agent PCBA Defluxing Cleaner for Flux Removal
Typical Property
P-ZT201 is a water-based, alkaline defluxing agent based on Micro Phase Cleaning (MPC®) technology. Formulated specifically for high-pressure spray-in-air applications (both inline and batch systems), it removes a wide variety of flux residues from printed circuit board assemblies (PCBAs).
Tags: PCBA defluxing cleaner, PCB flux remover, spray-in-air cleaning agent, low-standoff component cleaner, alkaline electronics cleaner.
Product Attributes
- Low-Standoff Cleaning: Designed to penetrate tight capillary spaces beneath low-standoff components such as Micro BGAs, Flip Chips, CMOS sensors, and 01005 passive components.
- Broad Flux Removal: Effective against leaded, lead-free, no-clean, rosin-based, synthetically activated, and water-soluble flux residues.
- Extended Bath Life: MPC® technology provides high bath loading capacity, lowering maintenance costs and total cost per cleaned assembly.
- Non-Foaming & Surfactant-Free: Formulated without surfactants to prevent white residue formation on boards or machinery and to avoid foaming under high spray pressure.
- Rinseability: Easily rinses away with DI water, leaving clean, residue-free solder joints and preparing surfaces for underfilling, wire bonding, or conformal coating.
- Broad Flux Removal: Effective against leaded, lead-free, no-clean, rosin-based, synthetically activated, and water-soluble flux residues.
- Extended Bath Life: MPC® technology provides high bath loading capacity, lowering maintenance costs and total cost per cleaned assembly.
- Non-Foaming & Surfactant-Free: Formulated without surfactants to prevent white residue formation on boards or machinery and to avoid foaming under high spray pressure.
- Rinseability: Easily rinses away with DI water, leaving clean, residue-free solder joints and preparing surfaces for underfilling, wire bonding, or conformal coating.
Technical Specifications (At 15% Concentration)
Property | Value / Specification |
Appearance | Clear liquid (concentrate diluted in DI water) |
Application Concentration | 10% – 20% in DI water |
Operating Temperature | 40 °C – 70 °C (104 °F – 158 °F) |
pH Value (10 g/L) | ~10.5 (Alkaline) |
Density (at 20 °C) | ~1.00 g/cm³ |
Flash Point | None until boiling |
Environmental Standard | Halogen-free, biodegradable, RoHS/WEEE compliant |
Applications
1. PCBA Defluxing: High-volume inline and batch spray-in-air defluxing of lead-free and leaded assemblies.
2. Advanced Packaging: Flux removal from Flip Chips and CMOS sensors to ensure void-free underfill.
3. Power LEDs & Power Modules: Flux cleanup after die attach to optimize wire bonding and light output.
2. Advanced Packaging: Flux removal from Flip Chips and CMOS sensors to ensure void-free underfill.
3. Power LEDs & Power Modules: Flux cleanup after die attach to optimize wire bonding and light output.